封装:
(45)
-(25)
Through Hole(293)
Board(1)
Solder(70)
100(3)
~(3)
Surface Mount(59)
`(1)
多选
包装:
(161)
-(1)
Tray(91)
Bulk(39)
Bag(75)
Box(1)
Tube(95)
Tape & Reel (TR)(2)
Tube, Rail(35)
多选
型号/品牌/封装
品类/描述
库存
价格(含税)
资料
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: Conn Wire to Board HDR 12POS 4.2mm Solder ST Thru-Hole Tray
    1152
    10-99
    10.3200
    100-499
    9.8040
    500-999
    9.4600
    1000-1999
    9.4428
    2000-4999
    9.3740
    5000-7499
    9.2880
    7500-9999
    9.2192
    ≥10000
    9.1848
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: Conn Power HDR 2POS Solder ST Thru-Hole 2 Terminal 1Port Mini-Fit® Plus Tray
    2003
    5-24
    3.9960
    25-49
    3.7000
    50-99
    3.4928
    100-499
    3.4040
    500-2499
    3.3448
    2500-4999
    3.2708
    5000-9999
    3.2412
    ≥10000
    3.1968
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 迷你圆弧设计加上HCSA ?? ¢产品规格 PRODUCT SPECIFICATION FOR Mini-Fit Plus HCS™
    4351
    5-49
    25.8219
    50-199
    24.7184
    200-499
    24.1004
    500-999
    23.9460
    1000-2499
    23.7915
    2500-4999
    23.6149
    5000-7499
    23.5046
    ≥7500
    23.3942
  • 描述: 7.50毫米( 0.295 “ )间距剑头,单排,直角, 5电路, PCB焊脚长度5.33毫米( .210 ” ) 7.50mm (.295") Pitch Sabre Header, Single Row, Right Angle, 5 Circuits, PC Tail Length 5.33mm (.210")
    2163
    5-49
    19.1295
    50-199
    18.3120
    200-499
    17.8542
    500-999
    17.7398
    1000-2499
    17.6253
    2500-4999
    17.4945
    5000-7499
    17.4128
    ≥7500
    17.3310
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 迷你圆弧设计加上HCSA ?? ¢产品规格 PRODUCT SPECIFICATION FOR Mini-Fit Plus HCS™
    1249
    5-49
    24.5934
    50-199
    23.5424
    200-499
    22.9538
    500-999
    22.8067
    1000-2499
    22.6596
    2500-4999
    22.4914
    5000-7499
    22.3863
    ≥7500
    22.2812
  • 描述: 7.50毫米( 0.295 “ )间距剑头,单排,直角, 2电路, PCB焊脚长度5.33毫米( .210 ” ) 7.50mm (.295") Pitch Sabre Header, Single Row, Right Angle, 2 Circuits, PC Tail Length 5.33mm (.210")
    1580
    10-99
    11.2320
    100-499
    10.6704
    500-999
    10.2960
    1000-1999
    10.2773
    2000-4999
    10.2024
    5000-7499
    10.1088
    7500-9999
    10.0339
    ≥10000
    9.9965
  • 描述: 7.50毫米( 0.295 “ )间距佩剑™头,单排,直角, 3电路, PCB焊脚长度5.33毫米( .210 ” ) ,无卡入式金属针,锡(Sn )镀层 7.50mm (.295") Pitch Sabre™ Header, Single Row, Right Angle, 3 Circuits, PC Tail Length 5.33mm (.210"), without Snap-In Metal Pins, Tin (Sn) Plating
    9181
    5-49
    12.9519
    50-199
    12.3984
    200-499
    12.0884
    500-999
    12.0110
    1000-2499
    11.9335
    2500-4999
    11.8449
    5000-7499
    11.7896
    ≥7500
    11.7342
  • 描述: 7.50毫米( 0.295 “ )间距剑头,单排,直角, 4个电路, PCB焊脚长度3.81毫米( .150 ” ) 7.50mm (.295") Pitch Sabre Header, Single Row, Right Angle, 4 Circuits, PC Tail Length 3.81mm (.150")
    2860
    5-49
    15.3270
    50-199
    14.6720
    200-499
    14.3052
    500-999
    14.2135
    1000-2499
    14.1218
    2500-4999
    14.0170
    5000-7499
    13.9515
    ≥7500
    13.8860
  • 描述: 7.50毫米( 0.295 “ )间距剑头,单排,直角, 2电路, PCB焊脚长度3.81毫米( .150 ” ) 7.50mm (.295") Pitch Sabre Header, Single Row, Right Angle, 2 Circuits, PC Tail Length 3.81mm (.150")
    9461
    10-99
    7.7160
    100-499
    7.3302
    500-999
    7.0730
    1000-1999
    7.0601
    2000-4999
    7.0087
    5000-7499
    6.9444
    7500-9999
    6.8930
    ≥10000
    6.8672
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 1.27毫米( .050 “ )由1.27毫米( .050 ” )间距SEARAY *插座, 114电路, 6.50毫米( .255 “ )未交配高度, 6排,带销,焊接费用™无铅 1.27mm (.050") by 1.27mm (.050") Pitch SEARAY* Receptacle, 114 Circuits, 6.50mm (.255") Unmated Height, 6 Rows, With Pegs, Solder Charge™ Lead Free
    7918
    1-9
    55.4124
    10-99
    52.2330
    100-249
    49.8712
    250-499
    49.5078
    500-999
    49.1444
    1000-2499
    48.7357
    2500-4999
    48.3723
    ≥5000
    48.1452
  • 描述: 1.27毫米( .050 “ )× 1.27毫米( .050 ” )间距SEARAY插头, 320电路, 2.00毫米( 0.078 “ )未交配高度, 8行,无铅 1.27mm (.050") x 1.27mm (.050") Pitch SEARAY Plug, 320 Circuits, 2.00mm (.078") Unmated Height, 8 Rows, Lead Free
    8921
    1-9
    206.5975
    10-49
    201.2080
    50-99
    197.0761
    100-199
    195.6389
    200-499
    194.5610
    500-999
    193.1238
    1000-1999
    192.2255
    ≥2000
    191.3273
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 1.27毫米( .050 “ )由1.27毫米( .050 ” )间距SEARAY插座, 240电路, 6.50毫米( .255 “ )未交配 1.27mm (.050") by 1.27mm (.050") Pitch SEARAY Receptacle, 240 Circuits, 6.50mm (.255") Unmated
    3131
    1-9
    146.1995
    10-49
    142.3856
    50-99
    139.4616
    100-199
    138.4446
    200-499
    137.6818
    500-999
    136.6648
    1000-1999
    136.0291
    ≥2000
    135.3935
  • 描述: Conn Wire to Board HDR 4POS
    3350
    5-49
    23.5755
    50-199
    22.5680
    200-499
    22.0038
    500-999
    21.8628
    1000-2499
    21.7217
    2500-4999
    21.5605
    5000-7499
    21.4598
    ≥7500
    21.3590
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100“ )间距KK PC板插座,顶部和底部进入,低调, 5.0um ( 200U ”),锡(Sn ) , 4电路 2.54mm (.100") Pitch KK PC Board Receptacle, Top and Bottom Entry, Low Profile, 5.0um (200u") Tin (Sn), 4 Circuits
    5230
    5-49
    12.1329
    50-199
    11.6144
    200-499
    11.3240
    500-999
    11.2515
    1000-2499
    11.1789
    2500-4999
    11.0959
    5000-7499
    11.0441
    ≥7500
    10.9922
  • 描述: 3.00毫米( 0.118 “ )间距微飞度3.0 , BMI ™插座头,双排,垂直,用压装的塑料钉, 0.38μm ( 15μ ”),金(Au )的选择性, 24电路 3.00mm (.118") Pitch Micro-Fit 3.0, BMI™ Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.38μm (15μ") Gold (Au) Selective, 24 Circuits
    4919
    1-9
    60.9390
    10-99
    57.4425
    100-249
    54.8451
    250-499
    54.4455
    500-999
    54.0459
    1000-2499
    53.5964
    2500-4999
    53.1968
    ≥5000
    52.9470
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 , BMI插座头,双排,直角,带压入塑料 3.00mm (.118") Pitch Micro-Fit 3.0, BMI Receptacle Header, Dual Row, Right Angle, with Press-fit Plastic
    5833
    1-9
    39.2474
    10-99
    36.9955
    100-249
    35.3227
    250-499
    35.0653
    500-999
    34.8079
    1000-2499
    34.5184
    2500-4999
    34.2611
    ≥5000
    34.1002
  • 描述: 3.00毫米( 0.118 “ )间距微飞度3.0 , BMI ™插座头,双排,直角,带压入塑料钉, 0.8微米( 30μ ”),金(Au )的选择性, 10电路 3.00mm (.118") Pitch Micro-Fit 3.0, BMI™ Receptacle Header, Dual Row, Right Angle, with Press-fit Plastic Pegs, 0.8μm (30μ") Gold (Au) Selective, 10 Circuits
    4099
    5-49
    34.8660
    50-199
    33.3760
    200-499
    32.5416
    500-999
    32.3330
    1000-2499
    32.1244
    2500-4999
    31.8860
    5000-7499
    31.7370
    ≥7500
    31.5880
  • 描述: Conn Wire to Board HDR 4POS Solder RA Thru-Hole Bulk
    7229
    10-99
    6.4200
    100-499
    6.0990
    500-999
    5.8850
    1000-1999
    5.8743
    2000-4999
    5.8315
    5000-7499
    5.7780
    7500-9999
    5.7352
    ≥10000
    5.7138
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: Conn Wire to Board RCP 24POS 4.2mm Solder ST Thru-Hole
    4915
    1-9
    39.9672
    10-99
    37.6740
    100-249
    35.9705
    250-499
    35.7084
    500-999
    35.4463
    1000-2499
    35.1515
    2500-4999
    34.8894
    ≥5000
    34.7256
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 4.20毫米( .165 “ )间距小飞度HCS ™接头,双排,垂直,无管理单元塑料栓锁电路板,电路10 ,PA聚酰胺尼龙6/6 94V - 2,具有排水孔 4.20mm (.165") Pitch Mini-Fit HCS™ Header, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock, 10 Circuits, PA Polyamide Nylon 6/6 94V-2, with Drain Holes
    8766
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI ™接头,表面安装, DualRow ,直角,无管理单元塑料钉板锁, 22电路, 0.76μm ( 30μ ” ) 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, DualRow, Right Angle, without Snap-in Plastic Peg PCB Lock, 22 Circuits, 0.76μm (30μ")
    1045
    1-9
    72.1510
    10-99
    69.0140
    100-249
    68.4493
    250-499
    68.0102
    500-999
    67.3200
    1000-2499
    67.0063
    2500-4999
    66.5671
    ≥5000
    66.1907
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI ™接头,表面贴装兼容 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible
    8694
    10-99
    9.8280
    100-499
    9.3366
    500-999
    9.0090
    1000-1999
    8.9926
    2000-4999
    8.9271
    5000-7499
    8.8452
    7500-9999
    8.7797
    ≥10000
    8.7469
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI ™接头,表面安装,双排,直角,无管理单元塑料钉板锁, 16电路, 0.76μm ( 30μ ”),金(Au )选择性电镀 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 16 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating
    8160
    1-9
    59.2432
    10-99
    55.8440
    100-249
    53.3189
    250-499
    52.9304
    500-999
    52.5419
    1000-2499
    52.1049
    2500-4999
    51.7164
    ≥5000
    51.4736
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI ™接头,表面安装,双排,直角,无管理单元塑料钉板锁, 20电路, 0.38μm ( 15μ ”),金(Au )选择性电镀 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 20 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating
    8236
    1-9
    58.7918
    10-99
    55.4185
    100-249
    52.9126
    250-499
    52.5271
    500-999
    52.1416
    1000-2499
    51.7079
    2500-4999
    51.3224
    ≥5000
    51.0814
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI ™接头,表面安装, DualRow ,直角,以管理单元塑料钉板锁,8个电路, 0.76μm ( 30μ ”),金(Au )选择性电镀 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, DualRow, Right Angle, with Snap-in Plastic Peg PCB Lock, 8 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating
    5582
    5-49
    24.5583
    50-199
    23.5088
    200-499
    22.9211
    500-999
    22.7742
    1000-2499
    22.6272
    2500-4999
    22.4593
    5000-7499
    22.3544
    ≥7500
    22.2494
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI ™接头,表面安装,双排,直角,无管理单元塑料钉板锁, 14电路,锡(Sn )镀层 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 14 Circuits, Tin (Sn) Plating
    1618
    5-49
    34.2693
    50-199
    32.8048
    200-499
    31.9847
    500-999
    31.7797
    1000-2499
    31.5746
    2500-4999
    31.3403
    5000-7499
    31.1939
    ≥7500
    31.0474
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI头,表面安装,双排,直角 3.00mm (.118") Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle
    7412
    1-9
    39.6134
    10-99
    37.3405
    100-249
    35.6521
    250-499
    35.3923
    500-999
    35.1325
    1000-2499
    34.8403
    2500-4999
    34.5806
    ≥5000
    34.4182
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI ™接头,表面安装,双排,直角,以管理单元塑料钉板锁, 12电路, 0.38μm ( 15μ ”),金(Au )选择性电镀 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 12 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating
    9486
    5-49
    29.1798
    50-199
    27.9328
    200-499
    27.2345
    500-999
    27.0599
    1000-2499
    26.8853
    2500-4999
    26.6858
    5000-7499
    26.5611
    ≥7500
    26.4364
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI ™接头,表面安装,双排,直角,以管理单元塑料钉板锁, 10电路, 0.76μm ( 30μ ”),金(Au )选择性电镀 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 10 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating
    8446
    5-49
    28.7235
    50-199
    27.4960
    200-499
    26.8086
    500-999
    26.6368
    1000-2499
    26.4649
    2500-4999
    26.2685
    5000-7499
    26.1458
    ≥7500
    26.0230
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI头,表面安装,双排,直角,以管理单元 3.00mm (.118") Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in
    7844
    1-9
    62.7900
    10-99
    60.0600
    100-249
    59.5686
    250-499
    59.1864
    500-999
    58.5858
    1000-2499
    58.3128
    2500-4999
    57.9306
    ≥5000
    57.6030

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